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The GPU chip behind the 3DS revealed

Posted on June 20, 2010 by (@NE_Brian) in 3DS, News

Now that the 3DS has been officially unveiled and the first round of specs were released by Nintendo, other companies are sharing additional information about the system. DMP has announced the system will be using the PICA200 GPU chip. There’s only a press release in Japanese for now, though you can read about the GPU’s abilities below.

“The PICA200 scales with up to four pipelines and processes from up to four programmable vertex units. The 3D core, using their proprietary graphics technology named MAESTRO-2G, the second generation of the Maestro design, implements custom graphics algorithms as hardware for enabling a set of shading features that include per-vertex sub-surface scattering, bidirectional reflectance distribution function, cook-torrance, polygon subdivision, and soft shadowing. Their image post-processing module, the PICA-FBM frame buffer management, can polish the image with anti-aliasing and a set of other 2D functions and can actually be licensed independently as a core for 2D-only devices. In either case, the PICA-FBM can be extended with a PICA-VG vector graphics module.”

Source 1, Source 2

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