A look inside the New 3DS
Posted on October 25, 2014 by Brian(@NE_Brian) in New Nintendo 3DS
A Japanese gamer who has experience in repairing iPhones recently decided to disassemble the New 3DS. You can view a few photos above.
Since there are metal cases on the main circuit, the main memory can’t be seen. Therefore rumors about the memory can’t be confirmed at this time. One thing that can be seen, however, is “SAMSUNG KLM4G1YEQC-B301”. That’s the same model number as chips used in smartphones. It’s more than possible then that 4GB eMMC NAND flash memory is included. To compare, the original 3DS features Toshiba’s 2GB NAND memory.
